Our equipment allows standard fine pitch structures down to 10/10 µm line/space

Our photolithography process defines patterns at very fine resolutions on square substrates that range in size from 4” to 24”, using a broad range of liquid photoresists. Our additive photolithography process creates circuit lines by sputtering a start layer, then, if needed, plating to build up conductive traces of precise height and width with the metal’s composition defined by you. This process secures a consistent trace definition at the exact thickness desired.

Consistent Repeatable Photolithography Resolution

Our photolithography process achieves image resolutions of down to five microns on substrates up to 6″ x 6″ by using glass masks in our mask-aligner. For larger substrates like 12” x 12” and 24” x 24” we realize a line/space of ten microns using our LDI (Laser Direct Imaging).