Assembly & Packaging
Assembly begins with the deposition by screen-printing of the epoxy conductive paste with the help of an automatic screen-printer. Manual and Automatic Pick and Place instruments allow a very precise mounting of the components.
For demanding applications, a computer-controlled oven can solder the components under controlled atmosphere.
For the interconnection, state of the art full automatic Al wedge-wedge as well as Au ball-wedge bonders allow the finest pitch that is currently available on the market.
- Pick & place
- Hermetic packaging