Markets & Products

Apart from the hybrid- and MCM-D market the high density flex cable / board technology HiCoFlex® serves a huge and constantly increasing market. Today’s market is divided into:

– sensors
– embedded PCB
– integrated components, e.g. 3D packaging (folded electronics)
– cryo cables, e.g. superconductive or harness cables with very low thermal capacity
– low to high frequency interconnections
– flexible MCM’s
– and last but not least your innovative ideas!