Our multilayer substrates are manufactured using additive thin-film technologies, enabling extremely high interconnect density. Up to four layers can be realised on various rigid substrates, with the conductor tracks made of Cu/Ni, gold or AuSn. Polyimide layers reliably insulate the individual metallisation layers from one another. A particular feature of our MCM solutions is the option to integrate highly precise NiCr resistors directly. Naturally, we also take care of all necessary assembly and testing steps, so that we can supply you with the finished circuit complete from a single source.