Technology
HiCoFlex® enables circuits with a total thickness of just 20 µm, which can even be folded. The technology is based on a specially developed polyimide that is temperature-resistant up to 350 °C, as well as a unique release layer that guarantees the finished circuit can be detached from the rigid carrier. HiCoFlex® products are characterised by multilayer circuits with a high connection density and remarkable flexibility. Thanks to our investment in state-of-the-art production facilities, we manufacture HiCoFlex® on rigid carriers up to 12" x 12", enabling high-volume series production of customised solutions.
Process
A HiCoFlex® circuit is treated like a rigid printed circuit board throughout the entire manufacturing process. The flexible circuit is built on a rigid carrier and is only detached after all production and inspection steps have been completed. This guarantees the same manufacturing quality as for rigid circuits. The multilayer structure is created by repeatedly applying polyimide and metal layers, with circuits of up to five metal layers being produced. The total thickness of such a film is around 50 µm, with excellent mechanical and electrical properties. As no adhesives or adhesive-based bonding materials are used in our manufacturing process, the finished circuits are completely outgassing-free, which is of particular importance in aerospace applications.
Micro cable
For catheter and endoscopy applications, we manufacture highly flexible connection cables with typical lengths of up to 1500 mm and conductor widths from 15 to 200 µm. The number of conductors ranges, depending on customer requirements, from 2 to 128, also with shielding. Thanks to thin-film technology and Cu/Ni/Au electroplating, these cables also deliver excellent high-frequency properties for microstrip, stripline and waveguide structures. Our decades of experience in the precise assembly of sensitive sensor components guarantees our customers a lasting competitive advantage.
Superconducting HiCoFlex®
Space missions and quantum computing systems place extreme demands on connections between different cryogenic temperature stages, starting at just 50 mK. Our superconducting HiCoFlex® cryogenic cables have been successfully used in several EU projects and meet the highest requirements for shielded, high-density multilayer cable harnesses. In addition, HiCoFlex® technology enables the integration of a very large number of fine, high-density conductors, allowing even complex cryogenic signal routing to be implemented reliably. The flexible design can be adapted to different requirements, and thermal conductivity measurements demonstrate its reliable applicability in active projects.
