We apply thin films to various substrate materials, including aluminium oxide (Al₂O₃), aluminium nitride (AlN), rigid carriers, metals such as molybdenum and steel, as well as polyimide. For deposition, depending on the requirements, we use sputtering with materials such as Cu, Ni, Au, NiCr, Ti, Cr, Pd, Pt, Sn, Nb, W90%Ti10% and Al, as well as electroplating for Cu, Ni, Au and Pt. Patterning is carried out using Laser Direct Imaging, mask alignment and etching on substrate sizes of 4", 6" and 12", as well as other sizes on request.