Additive process
Our photolithography process produces the finest structures on square substrates ranging from 4" to 12" using a wide selection of liquid photoresists. The additive process begins with sputtering a base layer, which is then galvanically enhanced if necessary to create conductor pathways with precisely defined height, width, and material composition.
Accuracy
For substrates up to 6" x 6", our mask aligner achieves resolutions down to 5 µm. For larger substrates up to 12" x 12", we use laser direct imaging, enabling us to reliably produce line/space structures of 10/10 µm. Both processes guarantee consistent, repeatable photolithographic resolution in serial production.
