Assembly process
The process begins with the order of a conductive epoxy paste using an automatic screen printing machine. Manual and automatic pick-and-place machines enable highly precise placement of the components. For demanding applications, a computer-controlled oven is available that solders the components under a defined atmosphere.
Connection technology
To produce bonded connections, we use the very latest Al wedge-wedge and Au ball bonders (wire bonding processes with the highest precision), which achieve the finest pitch dimensions available on the market. Our processes include pick and place, flip-chip, wire bonding, soldering and the hermetic sealing of housings.